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![pcb assembly process.jpg](https://static.wixstatic.com/media/c2838e_82c1195ef3a84042a2d30f7a3f7a0bc2~mv2.jpg/v1/fill/w_980,h_230,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/c2838e_82c1195ef3a84042a2d30f7a3f7a0bc2~mv2.jpg)
Rigid PCB Capacity
![pcb_assembly](https://static.wixstatic.com/media/c2838e_1e7f19b3f55a4620aaab6256db0b85bd~mv2.jpg/v1/fill/w_600,h_307,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/pcb_assembly.jpg)
At SUNSOAR, we are committed to advancing rigid PCB manufacturing capabilities through continuous annual investments in research and development. Our mass production facilities can now efficiently produce up to 18-layer PCBs, while our prototype manufacturing can handle complex designs with up to 56 layers. We welcome and embrace challenges from R&D departments, demonstrating our dedication to innovation and excellence in PCB technology.
Items | Mass | Prototypes |
---|---|---|
Layers | 1-18 Layers PCB | 1-56 Layers PCB |
Max. Panel Size | 600*770mm( 23.62″*30.31″) | 600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″) |
Max.Board Thickness | 8.5mm | 8.5mm |
Min. Board Thickness | 2L:0.3mm | 2L:0.1mm |
Min. Board Thickness | 4L:0.4mm | 4L:0.3mm |
Min. Board Thickness | 6L:0.8mm | 6L:0.6mm |
Min?Inner Layer Clearance | 3mil | 3mil |
Min Line width | 3/3 mil | 3/3 mil |
Min Line space | 3/3 mil | 3/3 mil |
Min.Hole Size | 0.1mm | 0.1mm |
Min plated hole thickness | 25um | 25um |
Min Blind/Buried hole size | 0.1mm | 0.1mm(1-18layers) |
PTH Dia. Tolerance | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
Non PTH Dia. Tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
Heavy Coppe | 4OZ/140μm | 6OZ/175μm |
Min S/M Pitch | 0.1mm (4mil) | 0.1mm (4mil) |
Soldermask colour | Green,black,Blue,White,Yellow,Red | Green,black,Blue,White,Yellow,Red |
Silkscreen?colour | White,Yellow,Red,Black | White,Yellow,Red,Black |
Outline | Routing,V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
Outline Tolerance | ±0.15mm ±6mil | ±0.15mm ±6mil |
Peelable mask | Top,bottom,double sided | Top,bottom,double sided |
Controlled Impedance | +/- 10% | +/- 7% |
Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
Through Hole?Resistance | <300Ω(Normal) | <300Ω(Normal) |
Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
Warp and Twist | ≤0.7% | ≤0.7% |
Electric Strength | >1.3KV/mm | >1.4KV/mm |
Peel Strength | 1.4N/mm | 1.4N/mm |
Solder Mask?Abrasion | >6H | >6H |
Flammability | 94V-0 | 94V-0 |
Test Voltage | 50-330V | 50-330V |
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