2025 Outlook: Emerging PCB Trends Driving IoT Growth Worldwide

SUNSOAR TE.
Jun 6, 2025
2 min read

The Internet of Things (IoT) continues to reshape industries and daily life, driving demand for smarter, smaller, and more efficient devices. At the core of this evolution is the printed circuit board (PCB), the foundational technology enabling complex electronics.

This article explores key PCB trends expected to drive IoT growth worldwide in 2025 and beyond.

1. Increased Adoption of Flexible and Rigid-Flex PCBs

Flexibility for New Form Factors

Flexible PCBs allow IoT devices to be thinner, lighter, and able to fit unconventional shapes, ideal for wearables and smart medical devices.

Combining Rigid and Flexible Layers

Rigid-flex PCBs offer the mechanical stability of rigid boards with flexible connectors, enhancing reliability and design possibilities.

2. Miniaturization Through HDI Technology

High-Density Interconnect (HDI) PCBs use microvias and fine traces to pack more functionality into smaller footprints. This trend supports compact IoT devices like smart sensors and portable medical monitors.

3. Integration of Advanced Materials

High-Frequency and Low-Loss Laminates

New PCB substrates optimize signal integrity for high-speed wireless communication like 5G and Wi-Fi 6, crucial for IoT connectivity.

Thermal Management Materials

Advanced materials improve heat dissipation, ensuring IoT devices maintain performance in varied environments.

4. Emphasis on Sustainability and Green Manufacturing

PCB manufacturers increasingly adopt eco-friendly processes, recyclable materials, and energy-saving production methods to meet global sustainability goals—aligning with IoT’s role in smart, green cities.

5. Enhanced Embedded Component Technologies

Embedding passive and active components directly into PCB layers reduces size and improves signal performance, opening new avenues for IoT device miniaturization.

6. Advanced Testing and Quality Assurance

As IoT devices become critical in health, safety, and industrial automation, PCB testing standards tighten. Automated optical inspection (AOI), X-ray, and in-circuit testing improve reliability and reduce failures.

Conclusion: PCB Innovation Powers IoT’s Future

The IoT market’s rapid growth demands PCBs that are smaller, smarter, and more sustainable. Trends like flexible PCBs, HDI technology, advanced materials, and embedded components will define the next generation of IoT devices.

Staying ahead in PCB innovation is essential for designers and manufacturers aiming to capture the vast opportunities IoT presents worldwide.