Is Your PCB Design Ready for the 5G Era? High-Frequency Requirements Explained
- SUNSOAR TE.
- May 18
- 2 min read
5G is no longer just a buzzword — it’s reshaping industries from consumer electronics to automotive systems and industrial IoT. But with high-speed connectivity comes a new set of design challenges, especially at the PCB level.
If your boards aren’t optimized for high-frequency signals, you might face unexpected signal loss, EMI problems, and unstable performance — even if your schematic looks perfect.
So, is your PCB ready for 5G? Let’s break it down.
What’s So Special About 5G?
5G works at frequencies up to 3–6 GHz (Sub-6) and even up to 28 GHz or higher for millimeter-wave applications. These frequencies demand:
Minimal signal attenuation
Precise impedance control
Excellent material stability over temperature
At this range, traditional PCB designs fall short. Traces become transmission lines, and materials matter more than ever.
3 PCB Design Requirements for High-Frequency Signals
1. Low-Loss Materials
Standard FR4 can’t keep up with high-frequency demands. At higher GHz ranges, signal loss becomes significant.
✅ Better materials:
Rogers (RO4350B, RO3003)
Isola (I-Tera MT40)
Panasonic Megtron
💡 Tip: Choose materials with low dielectric constant (Dk) and low dissipation factor (Df) for better signal integrity.
2. Controlled Impedance Routing
At 5G speeds, even a slight deviation in trace width or stackup can cause reflections or signal distortion.
Use differential pair routing for high-speed signals like USB 3.0 or RF lines.
Ensure tight tolerance control on stackup and trace geometry.
Consider coplanar waveguide or microstrip routing depending on your frequency.
📌 Partnering with a PCB supplier who provides stackup simulation and impedance verification is crucial here.
3. Minimized EMI and Crosstalk
5G PCBs are more sensitive to electromagnetic interference (EMI). Without proper design, signals can interfere with each other, causing performance issues.
✅ Design best practices:
Ground stitching vias around high-speed traces
Shielded zones or metal covers for RF sections
Shorter trace lengths, especially for antennas
Bonus Consideration: Antenna Integration
For 5G-connected devices, antenna performance is critical. Whether it’s a PCB antenna, chip antenna, or external module, placement and ground clearance need to be spot-on.
💡 Our RF engineering team helps optimize your antenna layout for max gain and minimal reflection — without trial-and-error.
Final Word: Don’t Let Your Design Bottleneck Your Product
You can have the best chip, the fastest processor, or the most innovative use case — but if your PCB isn’t designed for high-frequency transmission, your 5G product may underperform or even fail certification.
At Sunsoar, we’ve supported multiple 5G hardware launches with high-frequency material sourcing, controlled impedance stackups, and fast turnaround prototyping — all with up to 30% lower cost compared to overseas vendors.
Let’s check if your design is ready for the 5G era. Share your files for a free DFM + RF review.
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