Microvia Drilling Technology and Challenges in HDI PCBs
- Sunsoar engineer Mia
- 3 days ago
- 2 min read
Microvia Drilling in HDI PCBs: Precision Engineering with Real-World ChallengesPublished by Sunsoar PCB | www.pcbsun.com
As electronics become smaller, faster, and more powerful, HDI (High-Density Interconnect) PCBs have taken center stage in modern device design—from smartphones and wearables to automotive radar systems and medical equipment. At the heart of this technology is microvia drilling, a critical process that allows for compact layer interconnections without sacrificing performance or reliability.
What Are Microvias?
Microvias are tiny holes—typically less than 150 microns in diameter—used to connect different layers in a multilayer HDI PCB. They are often laser-drilled, making them more precise and space-efficient than traditional mechanical vias.
Microvias can be:
Blind vias (connecting outer layers to one or more inner layers),
Buried vias (connecting internal layers only),
Or stacked and staggered vias, used in multi-layer HDI builds.
Why Microvia Drilling Matters
Enables MiniaturizationDevices keep shrinking, but their functionality grows. Microvias make it possible to add more routing density without increasing board size.
Improves Signal IntegrityShorter and more direct interconnections reduce signal loss and cross-talk—ideal for high-speed applications.
Supports Complex BGA PackagesFine-pitch BGA components require precise connections. Microvias allow escape routing under dense chip packages without needing through-holes.
Key Challenges in Microvia Drilling
Despite their benefits, microvia drilling is not without its difficulties:
Drill Accuracy: Laser drilling demands micron-level precision to avoid damaging nearby traces or pads.
Void Formation: Incomplete plating of microvias can result in voids, leading to intermittent connections.
Stacked Via Reliability: Improper stacking or alignment can weaken via structures, especially under thermal cycling.
Cost and Yield: High-end equipment and tight process control increase manufacturing cost and require strict inspection to ensure quality.
How Sunsoar Overcomes These Challenges
At Sunsoar PCB, we use advanced UV and CO₂ laser drilling equipment combined with in-process inspection systems to ensure precise microvia formation. Our engineers:
Optimize layer stack-up for better thermal balance,
Use automated via-fill and planarization to eliminate voids,
And apply X-ray and cross-section analysis for quality assurance.
With experience in 6+ layer HDI PCBs, we support industries that demand both miniaturization and mission-critical reliability.
Need a custom HDI PCB with microvias?Reach out to us at sales03@sunsoartech.com or call +86 13632793113. We’ll help you get from concept to production—fast, smart, and scalable.
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