Thermal Simulation and Cooling Solutions for High-Power PCBs

Sunsoar engineer Mia
2 days ago
2 min read

Keeping It Cool: Thermal Simulation and Cooling Solutions for High-Power PCBsPublished by SUNSOAR | www.pcbsun.com

As electronic devices become more compact yet more powerful, thermal management is no longer just an afterthought—it’s a design priority. High-power PCBs used in LED drivers, EV battery systems, power converters, and industrial automation must deal with concentrated heat loads that, if unmanaged, can lead to failure, performance drops, or even safety hazards.

At SUNSOAR, we help customers tackle these challenges with a combination of thermal simulation and custom cooling solutions, ensuring every high-power board stays cool under pressure.

Why Thermal Simulation Matters

Thermal simulation uses software to predict how heat will distribute across a PCB before it's even manufactured. By modeling heat sources (like power ICs or MOSFETs), airflow, and material properties, we can identify hot spots and prevent design flaws that lead to real-world reliability issues.

With tools like ANSYS or SolidWorks Thermal, we analyze:

Heat flow paths across copper layers
Effects of via placement and copper pours
Component temperature rise under load
Heat sink effectiveness
Enclosure ventilation and airflow patterns

This early insight allows us to optimize the PCB layout, choose the right materials, and reduce the risk of thermal fatigue or delamination.

Cooling Solutions for High-Power Boards

Depending on power density and environmental conditions, SUNSOAR engineers deploy a mix of active and passive cooling techniques:

✅ Thermal Vias – Arrays of plated vias transfer heat from top layers to internal or bottom-side copper planes.✅ Heavy Copper Layers – Boards with 2oz, 3oz, or even 6oz copper efficiently spread and conduct heat.✅ Aluminum Substrates (MCPCBs) – Ideal for high-power LED or automotive modules; aluminum cores provide direct thermal conduction.✅ Heatsinks and Thermal Pads – For surface-mount power components, we design mechanical mounting solutions and integrate thermal interface materials (TIMs).✅ Forced-Air Cooling – In high-demand systems, we coordinate PCB design with fan or duct layouts to manage airflow efficiently.

Real-World Example

A recent industrial client approached SUNSOAR with a 120W power supply PCB that overheated during field testing. Our thermal simulation revealed that the VRM section was trapped in a dead air zone. We redesigned the layout, added thermal vias and aluminum-backed zones, and included cutouts for direct heat sink mounting. The result? A 21°C reduction in component temperature and no further overheating reports.